First iPhone 7 Prototype Images Emerge – Really Not That Different From An iPhone 6s

The first batch of Apple tree'south upcoming iPhone 7 have emerged, and we have to say that these images show no difference between the upcoming smartphone and an iPhone 6s, at to the lowest degree to our eyes. Let's come across if your hawkeye eyes can spot the differences.

No Headphone Jack Present On This iPhone seven Prototype – Expected To Be More Waterproof Than An iPhone 6s

The first affair that we noticed was the circular home push. There was a rumor suggesting that the upcoming iPhone seven was going to characteristic a 'click less' 3D Touch home button, and we can retrieve of 2 reasons for this. Apple could want to brand its iPhone 7 more waterproof than its predecessor, as the latest report suggests that the device volition be able to remain submerged for a longer flow. Nevertheless, this does not mean that the smartphone volition receive the IP68 certification, which is only given to smartphones that tin survive for 30 minutes while existence submerged in water till a depth of five feet.

The 2d reason would be to reduce the overall thickness, and we see no evidence of a headphone jack, thus confirming to an extent the limits that Apple intends on crossing to reduce the thickness of its future iPhones.

From a hardware perspective, the upcoming iPhone seven models are going to feature an A10 SoC, and from the looks of it, the chipset is powerful, just not as much every bit we would want it to be. The phone could also feature LTE modems from 2 dissimilar companies, forth with a pregnant RAM upgrade too. More than rumors disseminating give way to the fact that a larger gear up of iPhones are going to be announced and they will feature a 3,100mAh battery.

This is huge fifty-fifty by Apple tree standards, along with an on-board storage upgrade to 256GB. We wait that 256GB will exist nice petty upgrade for those who have capped their 128GB internal retention (for a premium price obviously).

Apple is also said to adopt a new fleck developing technology called FoWLP, which stands for fan-out wafer level packaging platform. With this technology, smartphone OEMs can profoundly reduce the thickness of their mobile devices since FoWLP does non require a PCB. Additionally, it is able to increase the efficiency of chips by thirty percent and reduce the thickness of smartphones past at least 0.3mm. Nosotros bet Apple's ears must be ringing when they were pitched that smartphone thickness could be using by employing this engineering in mobile devices.

Were you lot able to spot whatever differences betwixt the first iPhone 7 image and an iPhone 6s? Tell u.s.a. your thoughts right away.

Source

Source: https://wccftech.com/iphone-7-prototype-images/

Posted by: smithalitill.blogspot.com

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